Qualcomm’s Snapdragon 820 Said to Suffer from the Same Problem as 810

20 Jul

Qualcomm’s latest Snapdragon 820 processor, due to be released later this year, may be stuck with the same overheating problem as the Snapdragon 810, sources say.

According to a comment posted on Twitter by leaker Ricciolo, “the SD 810 and its successor are not too different in terms of heat issues.”

“You have to wait for the 830 [before the issue is ‘partially’ solved],” he wrote, adding that the earliest release date for the chip will be around Q3 of next year.

According to the local media, the 810’s overheating problems have already impacted the performances of numerous handsets, including Sony’s Xperia Z4 and the HTC One M9.

The 820 chip, which is expected to be manufactured using Samsung’s latest 14nm process, will attempt to minimize the overheating problem by using more advanced components. Some of the main devices that are expected to feature Qualcomm’s 820 chip include Google’s and Huawei’s Nexus 6, Xiaomi’s Mi 5 and Note 5, HTC’s Aero, and Sony’s Xperia Z5.

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