MediaTek Debuts Helio X30 Chip Featuring 10nm Process Technology

11 Aug

MediaTek, Taiwan’s leading fabless IC maker, has rolled out Helio X30 chip featuring 10nm process technology, scheduled for mass production in the first quarter of 2017, according to Digitimes, a domestic print media.

The chip, the company’s first product with 10nm process, will bring marked improvement in performance, enabling the company to catch up with its rivals, including Qualcomm, Samsung, Apple, Hisilicon of Huawei, and Spreadtrum, under Tsinghua Unigroup.

Chu Shan-chu, chief operating officer of MediaTek, points out that the company will start mass production of Helio P20 chip featuring 16nm process (containing eight A53 cores) in November this year, following its debut in February, one step behind Qualcomm, Samsung, Apple, and Hisilicon, according to the report. Even Spreadtrum kicked off mass production of eight-core processor SC9860 featuring 16nm process in May.

To fill the technology gap, MediaTek plans to advance mass production of Helio X30 to the first quarter 2017, ahead of Apple for its A11 process and perhaps even earlier than Qualcomm and Samsung.

In the future, Helio X30 processor will become MediaTek’s second-generation 10-core processor, reportedly containing, in addition to upgrading from 20nm to 10nm process, two 2.8GHz A73, four 2.2GHz A53, and four 2GHz A35 cores. Moreover, it will be furnished with four-core Power VR 7XT GPU and will support 26 million-pixel camera, twin cameras, and VR application.

For memories, Helio X30 will support four-channel LPDDR4, with maximum capacity of 8GB, embracing cutting-edge UFS 2.1 technological standard for storage. Its baseband structure will support three carrier aggregations, including full frequency range from Cat.10 to Cat.12. It will be meant for use by medium-to-high tier smartphones.