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Second-Quarter Server DRAM Revenue of the Top Three Suppliers Rose by 30.1% Sequentially on Tight Supply, Says TrendForce

16 Aug

For this second quarter, the total server DRAM revenue of the global top three DRAM makers – Samsung, SK Hynix and Micron – jumped by 30.1% compared with the prior quarter, as ASPs of server DRAM products remained high on continuing undersupply, says DRAMeXchange, a division of TrendForce. Despite product mix adjustments, suppliers had difficulty meeting the various growing demands in the DRAM market. (more…)

Toshiba Memory Corporation Unveils SATA Client SSD Utilizing 64-Layer, 3D Flash Memory

14 Aug

Toshiba Memory Corporation, the world leader in memory solutions, today announced the launch of the SG6 series, a new line-up of SATA client SSDs utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH. (more…)

Hujiang EdTech’s New Adaptive Learning Brand, Hitalk, Receives 98% Positive Feedback in Three Weeks

11 Aug

Hujiang EdTech (“Hujiang”), China’s leading online education company has recently held the launching ceremony of its new online English teaching brand Hitalk in Shanghai. Tailored specifically for adult English learners, Hitalk has received over 98% positive feedback after being launched only three weeks ago. (more…)

TrendForce Reports 4.6% Sequential Monthly Gain for Average Contract Price of PC DRAM Modules This July and Expects It to Keep Rising This Third Quarter

9 Aug

DRAM prices began to rise in the second half of 2016 and have maintained a strong upward momentum through the first half of 2017, according to data from DRAMeXchange, a division of TrendForce. (more…)

Toshiba Memory Corporation Unveils Single Package NVMe Client SSD Utilizing 64-Layer, 3D Flash Memory

9 Aug

Toshiba Memory Corporation, the world leader in memory solutions, has announced the launch of the BG3 series, a new line-up of single package NVM Express (NVMe) client SSDs integrating Toshiba Memory Corporation’s cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH and controller in a ball grid array (BGA) package. (more…)

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

9 Aug

Furukawa Electric Co., Ltd. has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape delivers high-grade separation of IC chips from wafers after the stealth dicing process. (more…)

Longsys’ World-First 11.5x13mm NVMe BGA SSD Drives New Mobile User Experience

8 Aug

Longsys, a world leader in consumer flash storage, today announced expansion of its DRAM-less SSD product line from Serial ATA (SATA) interface to Non-Volatile Memory Express (NVMe) interface. (more…)

Ondigo Refreshes Exclusive Accessory Program For Boost Mobile

8 Aug

Wireless accessory manufacturer and distributor, Ondigo has announced plans to refresh their accessory program for Boost Mobile. (more…)

X-naut Announces New Drone Controller Bracket Compatible With DJI Phantom and Inspire Mobile Device Holders

2 Aug

X-naut, developer of the “first to market” iPad overheating solution available- the Active Cooling Mount for iPads, has entered into the consumer and commercial Drone market with the launch of a new Drone Controller Bracket Compatible with DJI Phantom and Inspire Mobile Device Holders. (more…)

USB 3.0 Promoter Group Announces USB 3.2 Update

1 Aug

The USB 3.0 Promoter Group have announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices. USB Developer Days 2017 will include detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other exciting topics. (more…)