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Intel Introduces Portfolio of Commercial 5G New Radio Modems, Extends LTE Roadmap With Intel XMM 7660 Modem

23 Nov

Intel today announced substantial advances in its wireless product roadmap to accelerate the adoption of 5G. (more…)

Thousands Convene in Houston to Learn About the Latest In Automation Technology While Helping to Support Area Recovery

23 Nov

Thousands of industrial professionals are convening in Houston for the Automation Fair event to learn more about the latest advanced manufacturing technologies shaping the industry, and the automation tools that can help them be more globally competitive and productive. (more…)

TrendForce Says the Chinese Government Continues “Big Fund” to Support Key Semiconductor Sectors in China Including Memory and IC Design

21 Nov

China’s semiconductor industry has been thriving since 2015 driven by the Chinese government’s supportive policy and industry fund, with the revenue expected to exceed RMB 620 billion in 2018. (more…)

EnvisionTEC Unveils Enterprise Software Suite at formnext 2017 — Supports Volume Production with 3D Printers

21 Nov

EnvisionTEC, a leading global manufacturer of desktop and full-production 3D printers and materials, has announced an upgrade to its Perfactory Software Suite that allows users to prepare, monitor and manage print jobs on multiple 3D printers, among other benefits. (more…)

Toshiba Electronic Devices & Storage Corporation Releases 1.5A LDO Regulators in Industry’s Smallest Package for Mobile Applications

20 Nov

Toshiba Electronic Devices & Storage Corporation has started shipping “TCR15AG,” a low-dropout (LDO) regulator series in the industry’s smallest[1] WCSP6F package. The TCR15AG series is suitable for mobile and modular applications requiring small, thin devices. (more…)

New and innovative solutions for fabrication and welding will be on display from KUKA in booth #B23055 at FABTECH Chicago November 6-9, 2017

6 Nov

KUKA will be among 1,300+ world-class industry exhibitors at FABTECH 2017 in booth B23055. FABTECH is North America’s largest, metal forming, fabricating, welding and finishing event. (more…)

L-com Launches New USB 3.0 High-Flex Cable Assemblies

12 Oct

L-com Global Connectivity, a preferred manufacturer of wired and wireless connectivity products, announced today that it has introduced a new series of high-flex USB 3.0 cable assemblies for use with PC peripheral interconnects, data acquisition, test and measurement and portable data storage applications. (more…)

QuanticMind Secures $20M in Funding to Launch a New Era of Marketing Powered by Data Science and Machine Learning

12 Oct

QuanticMind, the data platform for intelligent marketing, today announced that it is raising a $20M Series B funding round led by veteran venture firm Foundation Capital, with additional participation from Safeguard Scientifics (NYSE:SFE) and Cervin Ventures. (more…)

Topmore Unveils “The Avengers” Series Water-Proof Wireless Sports Headphones

11 Oct

Taking advantage of the sports craze worldwide, Topmore, a hi-tech firm, has been working with Disney and Marvel to create a series of water-proof wireless sports headphones, with licensed motifs of Marvel “Avengers” heroes “Iron Man,” “Captain America,” and “Thor.” (more…)

Revolutionary USB 3.1 Connector from Yokowo Achieves Super Fast Data Transfer, without a Placing Shield.

10 Oct

Without the inclusion of a placing shield, Yokowo’s new USB 3.1 Connector handles high-speed signals (SSTX/RX) equivalent to USB 3.1 (10Gbps) and still blocks unnecessary signals. Instead, four ground pins shield the connector from interference and provide a big boost in data transfer speeds. The elimination of the placing shield has also eliminated any interference from the build up of dust on the connector. (more…)