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Kramer Brings Unique Focus on AV/IT Convergence to ISE 2017

3 Feb tech image

Kramer Electronics, Ltd. will be presenting a unique and diverse array of cutting-edge software-based AV solutions designed for IT professionals at ISE 2017 in Amsterdam in Booth 1-F20. Kramer’s complete pro AV portfolio of products and solutions will be on display, featuring Presentation, Control, Collaboration, Connectivity, and Audio along with new and innovative products and technologies. (more…)

Chinese Mobile Manufacturers Must Prioritize Handset Customization to Boost Audio Quality, Pinpoints ABI Research Teardowns

1 Feb china flag

In recent mobile teardowns, ABI Research pinpoints that Chinese mobile manufacturers must prioritize handset customization to include higher quality audio. (more…)

Elon Musk, Mark Fields, Michael Dell and Others to Constitute Trump’s Manufacturing Council

30 Jan donald-trump-tp-default

By Aditya Srivastava, The Tech Portal

Donald Trump’s Manufacturing council, headed by Dow Chemical CEO Andrew Livers, has now announced the name of all its members today. Tesla CEO Elon Musk, who was already on Trump’s Strategic and Policy Forum for advising over economic matters, is also a part of this council. Which means now Mr. Musk will be present in two different advisory groups for Trump’s administration. (more…)

Infineon Enables Compact and Cost-Effective LED Front Light Applications with LITIX LED Driver Family

13 Jan infineon company

LEDs in automotive front lighting enable energy savings, new light designs and applications such as matrix beam and laser high-beam. Supporting the progress in automotive lighting Infineon Technologies AG launched high-power LED drivers specifically designed for automotive front lights. The drivers are available within the new LITIX Power Flex series and the LITIX Power series. They address flexible DC/DC driver solutions supporting LED systems of up to 50 W and even above. Application setups can vary: many medium-power LEDs with string voltages of up to 55 V or few LEDs with high currents of up to 3 A and more. (more…)

China’s Tsinghua Unigroup to Continue Expansion, Build Foundries in Chengdu, Nanjing

12 Jan unigroup111301-624x414

China’s government-backed Tsinghua Unigroup will invest US$46 billion in two foundries in Chengdu and Nanjing and continue its expansion and talent poaching in 2017, according to company chairman Zhao Weiguo. (more…)

ARM Denies Restricting Licensees in Developing Executable x86 Systematic Chips

12 Jan ARM-Holdings-624x468

ARM executives reported that ARM doesn’t restrict licensed chip firms in developing executable x86 systematic chips, adding that there is no legal basis to make such restriction, according to a Chinese media report. (more…)

Will Inventec Begin Manufacturing in the U.S.?

12 Jan money 2

Inventec chairman Richard Lee recently said the company would consider moving some production to the U.S. if customers agree. “If our customers want us to make products locally in the U.S. we will definitely do so,” he was quoted as saying in the Nikkei Asian Review. “We do have a plan about that… but it all depends on our clients’ will.” (more…)

Huawei and AlgoSec to Deliver Integrated Security Policy Management to Drive Network Agility

11 Jan 640_huawei_logo-624x415-490x325

Huawei on Monday announced a partnership with AlgoSec, the market leader for business-driven security policy management. Through this partnership, Huawei security integrates its full range of firewall-related solutions with AlgoSec’s security policy management solution to enable joint customers to streamline and automate security management operations, enhance visibility and improve security, compliance and business agility. (more…)

ON Semiconductor and Hexius Semiconductor Expand Scope of Analog Functionality for Next Generation Mixed Signal ASICs

10 Jan ON_Semiconductor_Logo-640x372-490x284

ON Semiconductor, driving energy efficient innovations, has announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process. (more…)

ASUS Relies on Infineon REAL3 Image Sensor Chip to Bring Augmented Reality into Compact Smartphones

6 Jan infineon company

The REAL3 image sensor chip from Infineon Technologies AG plays a key role in the newest innovative Augmented Reality (AR) smartphone by ASUS. The mobile device was launched yesterday at International CES 2017 (International Consumer Electronics Show) in Las Vegas. The ASUS Zenfone AR is the world’s thinnest smartphone that offers a 3D Time-of-Flight (ToF) camera for 3-dimensional perception of its surroundings in real-time. (more…)