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TrendForce Says Mobile DRAM Revenue Grew 14.8% Sequentially in Second Quarter and Will Keep Climbing in Third Quarter

28 Aug

DRAMeXchange, a division of TrendForce, reports that the global mobile DRAM market experienced some recovery during the second quarter, though smartphone sales remained sluggish. Smartphone brands had lowered their annual production volume targets in the first quarter and in turn faced inventory pileup for memory components. (more…)

TrendForce Says Global NAND Flash Revenue from Branded Manufacturers Grew by 8% Sequentially in 2Q17; NAND Flash Prices to Keep Rising in 3Q17

22 Aug

DRAMeXchange, a division of TrendForce, reports that the NAND Flash market continued to experience tight supply in the second quarter. As a result, contract prices of various lines of NAND Flash products rose by 3% to 10% from the first quarter despite the seasonal headwinds. Going forward, NAND Flash suppliers are expected to post excellent revenue results in the third quarter due to small increases in contract prices of mobile products (i.e. eMMC and UFS) and SSDs. On the whole, 2017 will be a bumper year for the industry. (more…)

Broadcom Limited Again Topped TrendForce’s Latest Revenue Ranking of Top 10 IC Design Houses Worldwide for Second Quarter

22 Aug

Broadcom Limited, Qualcomm and NVIDIA respectively took first, second and third place in TrendForce’s latest ranking of the global top 10 fabless IC design houses for the second quarter of 2017. With MediaTek and Marvell as exceptions, the eight other design houses in the top 10 ranking posted year-on-year revenue growth. (more…)

Intevac Announces Multi-System HDD Order for 200 Lean Systems

18 Aug

Intevac, Inc., a leading supplier of thin-film processing systems, has announced the receipt of an order for two 200 Lean systems, which will be equipped with the latest technology enhancements for HDD magnetic media sputtering. (more…)

Second-Quarter Server DRAM Revenue of the Top Three Suppliers Rose by 30.1% Sequentially on Tight Supply, Says TrendForce

16 Aug

For this second quarter, the total server DRAM revenue of the global top three DRAM makers – Samsung, SK Hynix and Micron – jumped by 30.1% compared with the prior quarter, as ASPs of server DRAM products remained high on continuing undersupply, says DRAMeXchange, a division of TrendForce. Despite product mix adjustments, suppliers had difficulty meeting the various growing demands in the DRAM market. (more…)

Toshiba Memory Corporation Unveils SATA Client SSD Utilizing 64-Layer, 3D Flash Memory

14 Aug

Toshiba Memory Corporation, the world leader in memory solutions, today announced the launch of the SG6 series, a new line-up of SATA client SSDs utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH. (more…)

Hujiang EdTech’s New Adaptive Learning Brand, Hitalk, Receives 98% Positive Feedback in Three Weeks

11 Aug

Hujiang EdTech (“Hujiang”), China’s leading online education company has recently held the launching ceremony of its new online English teaching brand Hitalk in Shanghai. Tailored specifically for adult English learners, Hitalk has received over 98% positive feedback after being launched only three weeks ago. (more…)

TrendForce Reports 4.6% Sequential Monthly Gain for Average Contract Price of PC DRAM Modules This July and Expects It to Keep Rising This Third Quarter

9 Aug

DRAM prices began to rise in the second half of 2016 and have maintained a strong upward momentum through the first half of 2017, according to data from DRAMeXchange, a division of TrendForce. (more…)

Toshiba Memory Corporation Unveils Single Package NVMe Client SSD Utilizing 64-Layer, 3D Flash Memory

9 Aug

Toshiba Memory Corporation, the world leader in memory solutions, has announced the launch of the BG3 series, a new line-up of single package NVM Express (NVMe) client SSDs integrating Toshiba Memory Corporation’s cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH and controller in a ball grid array (BGA) package. (more…)

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

9 Aug

Furukawa Electric Co., Ltd. has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape delivers high-grade separation of IC chips from wafers after the stealth dicing process. (more…)