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TrendForce Says Intel’s Upgrade of Its Dalian Plant Will Bring China’s Thriving Storage and Memory Market to a New Level

22 Oct

Intel announced on October 20 that it will convert its fab in Dalian, China, from making processor chips on the 65nm process to making 3D-NAND Flash chips, which is currently the most advanced memory chip product. Intel also stated that it will invest up to US$5.5 billion in this project and work with the local government in its implementation. (more…)

Toshiba and SanDisk Announce Start of Equipment Installation at Yokkaichi’s New Fab 2

21 Oct

Toshiba and SanDisk Corporation today announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations. New Fab 2 is primarily intended to provide the clean room space necessary to transition a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory. The companies also signed definitive agreements for joint manufacturing of 3D flash memory and investment in New Fab 2. (more…)

DRAM and NAND Flash Consumption in China to Reach US$12 Billion and $6.67 Billion Respectively in 2015 as Domestic Demand Grows: TrendForce

16 Oct

According to the latest research from DRAMeXchange, a division of TrendForce, server and smartphone shipment demand continues to grow in the immense Chinese memory market. The latest forecast indicates that China will consume US$12 billion worth of DRAM and US$6.67 billion worth of NAND Flash in 2015. These figures represent 21.6% and 29.1% of the global DRAM and NAND Flash industries’ total revenues for the year, respectively.


TrendForce Says NAND Contract Price Down 6~7% in August’s Second Half; Market Oversupplied Until Next First Quarter

3 Sep

Smartphone, tablet and notebook vendors have marked down their shipment targets in response to the slowing of the global economic recovery in the second half of 2015, according to the latest research from DRAMeXchange, a division of TrendForce. This in turn has weakened the seasonal demand drive for eMMC, eMCP and Client-SSD products during this peak period. (more…)

Varied Performance Results for NAND Flash Suppliers in Q2 as They Pursue Different Business Strategies, Says TrendForce

14 Aug

NAND flash suppliers’ revenue results, profit margins and other performance indicators varied because of differences in their eMMC, eMCP and SSD product strategies. Suppliers are working hard to accelerate the development of 15nm and 16nm TLC-based products such as eMMC, eMCP, SSD and other embedded products. Furthermore, NAND flash makers with the exception of Samsung are expected to begin small-batch runs of 3D-NAND flash in the fourth quarter of this year, according to DRAMeXchange, a division of TrendForce. (more…)

The NAND Flash industry advances with TLC products taking charge of the market drive, says TrendForce

19 Mar

The newest report from DRAMeXchange, a division of TrendForce, indicates that TLC NAND flash will account for nearly half of the total NAND flash output in 4Q15. With TLC NAND applications shifting from memory card and USB drive to OEM storage devices such as eMMC/eMCP and SSD, manufacturers will in turn launch their TLC-based storage solutions this year. The ratio of TLC NAND flash output will therefore continue to grow. (more…)

Memory technology to fuel the next round of patent wars: iRunway Research report

23 Feb

Austin, TX, February 18, 2015 – iRunway, a technology consulting firm specializing in patent licensing and litigation, has released a comprehensive new report revealing leading patent holders in semiconductor memory technology. (more…)

Toshiba, SK Hynix join hands in nano-imprint lithography process

8 Feb

Toshiba, the world’s second largest NAND flash memory manufacturer, announced in a press release Feb. 5 that in order to accelerate the progress in nano-imprint lithography (NIL) development, the company has signed a joint development agreement with South Korea’s SK Hynix. The two sides will start the development of basic technologies for the process at Toshiba’s Yokohama plant in Japan in April this year, targeting practical use in 2017. (more…)

NAND Flash Brand Suppliers’ Overall Quarterly Revenue Increased by 2% in 4Q14, Supply to Exceed Demand in 1Q15

5 Feb

The NAND flash market was generally healthy in the fourth quarter of 2014, according to DRAMeXchange, a division of TrendForce. However, Samsung, Toshiba and SanDisk respectively faced pressures such as competitive pricing and end-market demands. Because of these pressures and the slight market downturn in the previous quarter, the NAND flash brand suppliers saw just a 2% quarterly increase in revenue, or at US $8.75 billion. (more…)

Production at Samsung’s memory fab in Xi’an halts temporarily with little impact

29 Jan

South Korean media Digital Daily reported that production at Samsung Electronics’ 3D NAND Flash facility in Xi’an, China, recently came to a temporary halt. Over 30,000 wafers were scrapped as the result of the interruption and loss was estimated at US$60 million. However, according to information obtained in South Korea by Technews, the halt took place in December 2014, rather than January this year as reported by the South Korean daily. Technews’s sources said some 1,000 wafers were damaged, as opposed to 30,000. (more…)