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Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

8 Oct

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. (more…)

Mitsubishi Electric’s New Plant in Gujarat, India to Produce Automotive Products

8 Oct

Mitsubishi Electric Corporation (TOKYO: 6503) has announced that it will start construction of a new plant on the premises of its subsidiary Mitsubishi Electric Automotive India Pvt. Ltd (MEAI) in Gujarat, India. (more…)

Car Makers Step Up Development of ADAS and Self-Driving Technologies to Cope With the Impacts of the US-China Trade Dispute, Says TrendForce

7 Oct

The latest figures provided by the global research firm TrendForce show that car sales in the US for 2019 are projected to slide by 3% YoY. China’s car sales for the same year are also projected to drop by 7% YoY. The ongoing trade dispute between the US and China has taken a serious toll on the global automotive market, which is now facing a continuous decline in sales. Now struggling under a negative market cycle, major car makers have proceeded to cut costs through layoffs. On the other hand, they are also directing more of their resources into developing functions pertaining to advanced driver assistance systems (ADAS) and automated driving systems (ADS) for their upcoming vehicle models. (more…)

Trinseo to Build New TPE Pilot Facility in Hsinchu, Taiwan

7 Oct

Trinseo (NYSE: TSE), a global material solutions provider and manufacturer of plastics, latex binders, and synthetic rubber, announced today its plans for a Thermoplastic Elastomers (TPE) pilot facility in Hsinchu, Taiwan. The TPE pilot facility emphasizes Trinseo’s growth strategy for TPEs globally and will serve customers in the Automotive, Consumer Electronics, Footwear and Medical markets. The pilot facility will be built at Trinseo’s existing manufacturing site in Hsinchu and will begin operation in 2020. (more…)

MobileIron Announces Support for Oculus for Business to Secure the Modern Enterprise

7 Oct

MobileIron (NASDAQ:MOBL), the company that introduced the industry’s first mobile-centric, zero trust platform for the enterprise, today announced support for the upcoming release of Oculus for Business. Organizations will be able to onboard, configure and manage Oculus’ leading all-in-one virtual reality (VR) headsets, Oculus Quest and Oculus Go, as part of their established unified endpoint management (UEM) infrastructure, simplifying the entire device lifecycle – from enrollment to retirement. (more…)

Emerging Social Network Uhive Ranked Top 500 Tech Company in the World

4 Oct

Uhive, a new disruptive social network built on the foundation of human psychology, driven by an AI brain, and powered by a blockchain-based digital currency has just been ranked as one of the top 500 tech companies in the world by Crunchbase. Crunchbase is the leading platform for insights on 675,000 tech companies from early-stage startups to the Fortune 1000, and has over 50 million users including investors, entrepreneurs and journalists. (more…)

Toshiba Memory America Introduces Next-Gen Serial Interface NAND

4 Oct

Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, has announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely used Serial Peripheral Interface (SPI), Toshiba Memory’s second-generation Serial Interface NAND can be used in a wide range of consumer and industrial applications that require high-speed data transfers, including flat screen TVs, printers, wearable devices, and robots. (more…)

New Context and Idaho National Laboratory to Develop Operational Cybersecurity Technology

3 Oct

New Context, a leading innovator in cybersecurity research for highly regulated industries, has announced its ongoing collaboration with the U.S. Department of Energy (DOE) and the Idaho National Laboratory (INL) to research and develop next-generation operational technology (OT) cybersecurity tools. These technologies will strengthen the protection of U.S. critical infrastructure, including the electric grid, from cyber threats. (more…)

New OnePlus 7T Phone Uses Elliptic Labs AI Virtual Sensor

3 Oct

Elliptic Labs’ INNER BEAUTY® AI Virtual Proximity Sensor is powering the much-anticipated flagship OnePlus 7T smartphone, which is being rolled out today. Elliptic Labs, the world leader in virtual sensor platforms, had previously announced their contract win but is only now making details available. (more…)

StratEdge High-Frequency and High-Power Packages and Assembly Services to be Featured at IMAPS and European Microwave Week 2019 Events

2 Oct

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz at the International Symposium for Microelectronics (IMAPS) 2019 and European Microwave Week 2019. StratEdge will exhibit in booth 234 at IMAPS, being held in Boston, Massachusetts on October 1-2 and in booth 2220 at European Microwave Week, being held at Porte de Versailles Paris, France from October 1-3. (more…)